The age of explosive technological advancements is partly characterized by the continuous downsizing of our electronic possessions, be they computers, smartphones, tablets or even vehicles. Such electronic appliances are becoming more compact and lightweight, thanks to the continuous evolution of microelectronic components.
In the domain of microelectronic engineering, generation after generation of electronic components, each smaller than the previous, have been invented, in a bid to better perform existing functions or create even more advanced ones, while using as little space as possible.
To this end, nanofabrication has a prominent position in SENG’s research repertoire, as it deals with the design and manufacture of devices measured in nanometers. Such creations pave the way for the manufacture of increasingly important components, such as super-high-density microprocessors and memory chips.
Meanwhile, the wiring techniques entailed in either digital integrated or analog circuits play a pivotal role in the performance of minuscule electronic gadgets and components. Here at SENG, experts in the field of electronic and computer engineering have immersed themselves in the research and development of circuits and devices such as analog integrated circuits, as well as the important technology of very-large-scale integration (VLSI), which is responsible for creating an integrated circuit by combining and fitting millions of transistors into a single chip.
Besides, our research has consistently led to significant discoveries in the fields of sensor technology, data converters and semiconductors including compound or high frequency semiconductor devices.
On the whole, our study of microelectronics has been laying a solid foundation for bringing small-scale gadgets to the next level—reducing their sizes without compromising their superb functionalities.
Relevant Faculty Members
Relevant Research Infrastructure
- Huawei-HKUST Innovation Laboratory
- State Key Laboratory (SKL) of Advanced Displays and Optoelectronics Technologies
- Center for Advanced Microsystems Packaging (CAMP)
- Center for Display Research (CDR)
- Center for Integrated Micro Systems (CIMS)
- Integrated Circuits Design Center (ICDC)
- Photonics Technology Center
- Radio Frequency Identification (RFID) Center
- Nanosystem Fabrication Facility (NFF)