Yansong YANG 楊岩松

Yansong YANG 楊岩松 Details

Yansong YANG 楊岩松
Yansong YANG 楊岩松 

Email

Email
eeyyang@ust.hk

Office

First Name (and Middle Name If Any)
Yansong
YANG
楊岩松
Highest Degree Acquired (e.g. PhD in Engineering Science)
PhD in Electrical and Computer Engineering, University of Illinois Urbana-Champaign

Contact Information

Email

Email
eeyyang@ust.hk

Office

Research Interests

Research Interests
Electronic-photonic integrated circuits
Fabrication technology
Microelectromechanical systems (MEMS)
Microwaves
Radio frequency (RF)

Biography

Biography

Before joining HKUST, Yansong Yang was a Postdoctoral Research Associate at University of Illinois at Urbana-Champaign (UIUC), where he received the MS and PhD degree in Electrical Engineering in 2017 and 2019.

His lab focuses on developing multi-physics (including electrical, mechanical, and optical domains) hybrid microsystems for signal processing, sensing, and computing on a single chip. The related work includes the design and nano-microfabrication techniques of novel RF MEMS platforms (resonators, filters, delay lines, switches, etc.) and photonic integrated circuits for higher operating frequencies and efficiency. 

His works have been awarded Best Paper Awards six times and Best Paper finalists two times in top-tier international conferences. His publications have been awarded as “JMEMS RightNow Papers” of IEEE Journal of Microelectromechanical Systems. He has filed more than ten patents in the U.S. and China, and his published works have been adopted in dozens of patents of RF companies.

Research Interests

Research Interests
Electronic-photonic integrated circuits
Fabrication technology
Microelectromechanical systems (MEMS)
Microwaves
Radio frequency (RF)

Biography

Biography

Before joining HKUST, Yansong Yang was a Postdoctoral Research Associate at University of Illinois at Urbana-Champaign (UIUC), where he received the MS and PhD degree in Electrical Engineering in 2017 and 2019.

His lab focuses on developing multi-physics (including electrical, mechanical, and optical domains) hybrid microsystems for signal processing, sensing, and computing on a single chip. The related work includes the design and nano-microfabrication techniques of novel RF MEMS platforms (resonators, filters, delay lines, switches, etc.) and photonic integrated circuits for higher operating frequencies and efficiency. 

His works have been awarded Best Paper Awards six times and Best Paper finalists two times in top-tier international conferences. His publications have been awarded as “JMEMS RightNow Papers” of IEEE Journal of Microelectromechanical Systems. He has filed more than ten patents in the U.S. and China, and his published works have been adopted in dozens of patents of RF companies.