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First Awardee from China

Prof. Ricky LEE Received 2021 ASME Avram Bar-Cohen Memorial Award

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Prof. Ricky Lee is the first recipient from China since the prestigious ASME Avram Bar-Cohen Memorial Award (formerly the InterPACK Achievement Award) was first presented in 1999.
Prof. Ricky Lee is the first recipient from China since the prestigious ASME Avram Bar-Cohen Memorial Award (formerly the InterPACK Achievement Award) was first presented in 1999. [Download Photo]
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Prof. Ricky LEE Shi-Wei, Chair Professor of Mechanical and Aerospace Engineering and Acting Dean of Systems Hub of HKUST (Guangzhou), received the 2021 Avram Bar-Cohen Memorial Award (previously named as InterPACK Achievement Award) by the American Society of Mechanical Engineers (ASME).

Established in 1999, this prestigious award is given annually or biennially to a single individual who demonstrates excellence and international recognition in the area of research and development related to electronic packaging, as well as service to the technical community at large. Prof. Lee is the only awardee who develops his entire professional career in China among the 14 winners to date. The announcement was made at the ASME 2021 InterPACK Conference, the flagship conference of the ASME Electronic and Photonic Packaging Division, and was held virtually on October 26-28.

“Prof. Avram Bar-Cohen was one of the most influential icons in the professional community of electronic packaging. Due to his passing in 2020, the original InterPACK Achievement Award was elevated to Avram Bar-Cohen Memorial Award in 2021. Being a follower of Prof. Bar-Cohen, I feel extremely honored and privileged to be the first recipient of ASME Avram Bar-Cohen Memorial Award. I am deeply indebted to many people that made this happen,” said Prof. Lee.

An eminent leader in the field, Prof. Lee has been focusing his research on the development of packaging and assembly technologies for electronics and optoelectronics. The topics of his R&D interests include wafer-level packaging and 3D IC integration, additive manufacturing, LED packaging for solid-state lighting, lead-free soldering and reliability analysis.

Prof. Lee’s seminal contributions over the years have been recognized by many honors and awards, including 13 best/outstanding paper awards and six major professional society awards. He is a Fellow of IEEE, ASME, IMAPS, and Institute of Physics (UK). The research outcomes of Prof. Lee’s group have been documented in numerous technical papers in international journals and conference proceedings. He also co-authored four books and nine book chapters. Currently, he is the editor-in-chief of ASME Journal of Electronic Packaging.

Prof. Lee joined HKUST in 1993, after his PhD and postdoctoral research at Purdue University. In addition to his leadership role at HKUST(GZ), he has concurrent appointments as Executive Director of Shenzhen Platform Development Office, Director of HKUST Foshan Research Institute for Smart Manufacturing, and Director of HKUST LED-FPD Technology Research and Development Center at Foshan.