Two papers from the ECE department of HKUST have been accepted for presentation at the 2010 International Solid-State Circuits Conference (ISSCC), also known as “the Chip Olympic”, in San Francisco in February 2010.

The first paper titled “EPC Gen-2 System-On-Chip Passive UHF RFID Tag with Embedded Temperature Sensor” is co-authored by Jun Yin, Jun Yi, M. Law, M. Ling, P. Lee, B. Ng, B. Gao, H. C. Luong, A. Bermak, M. Chan, W. H. Ki, C. Y. Tsui and M. Yuen. The paper presents the design and integration of a complete EPC C1G2 RFID tag inlay consisting of a system-on-chip passive RFID tag IC with embedded temperature sensor bonded to an antenna via flip-chip assembly technology.

The second paper titled "A Two-Phase Switching Hybrid Supply Modulator for Polar Transmitters with 9% Efficiency Improvement" is co-authored by Y. WU and P. Mok. This paper describes an advanced hybrid power modulator design for W-CDMA polar transmitters, which boosts the efficiency of the RF power amplifiers and extends battery lifetime in mobile radios application.

The ISSCC is the foremost forum for presentation of advances in solid-state circuits and systems-on-a-chip. The Conference offers a unique opportunity for engineers working at the cutting edge of IC design and use to maintain technical currency, and to network with leading experts.