SENG News

The MSc Fintech program launch ceremony is officiated by Prof. Lionel NI, Provost of HKUST (fifth right); Prof. TAM Kar-Yan, Dean of School of Business and Management (fourth right); Prof. Richard SO, Associate Dean of School of Engineering (Research and Graduate Studies) (second left) and Prof. Tim LEUNG, Associate Dean (Recruitment) of School of Science (first left) . Guests including Prof. Ning CAI, Program Director of the MSc Fintech Program (first right); Prof. HUI Kai-Lung, HKUST School of Business an
The MSc Fintech program launch ceremony is officiated by Prof. Lionel NI, Provost of HKUST (fifth right); Prof. TAM Kar-Yan, Dean of School of Business and Management (fourth right); Prof. Richard SO, Associate Dean of School of Engineering (Research and Graduate Studies) (second left) and Prof. Tim LEUNG, Associate Dean (Recruitment) of School of Science (first left) . Guests including Prof. Ning CAI, Program Director of the MSc Fintech Program (first right); Prof. HUI Kai-Lung, HKUST School of Business an 
Multidisciplinary Education to Bridge Talent Gap in Fintech Industry
Group photo at HKUST Piazza
Group photo at HKUST Piazza 
Multicultural Talents to Explore Postgrad Study Opportunities
Dr. Ervin Shu created a medical device, CryoChip, to help couples struggling with infertility by automating and standardizing the process of embryo vitrification.
Dr. Ervin Shu created a medical device, CryoChip, to help couples struggling with infertility by automating and standardizing the process of embryo vitrification. 
Prof. Khaled BEN LETAIEF (center) and Prof. ZHANG Jun (second right) received the award at the 2019 IEEE International Symposium on Information Theory in Paris on July 9.
Prof. Khaled BEN LETAIEF (center) and Prof. ZHANG Jun (second right) received the award at the 2019 IEEE International Symposium on Information Theory in Paris on July 9.  
First-ever Awardees from Greater China for Paper on 5G-related Tech
Prof. Tim WOO (first right, back row), HKUST ROV Team members, as well as organizers of the MATE International ROV Competition
Prof. Tim WOO (first right, back row), HKUST ROV Team members, as well as organizers of the MATE International ROV Competition 
Bringing Awards Tally of HKUST Robotics Team Into the Hundreds
(From right) Prof. Vincent LAU and Prof. Lionel NI received the prizes at the award presentation ceremony on June 19, 2019.
(From right) Prof. Vincent LAU and Prof. Lionel NI received the prizes at the award presentation ceremony on June 19, 2019. 
National Honors for Faculty’s Outstanding Research Output
Prof. Tim CHENG, Dean of Engineering of HKUST (front left), and Ms. LAI Xin, ThunderChain’s Chief Engineer of Xunlei (front right), sign the collaborative agreement to establish HKUST-Xunlei Joint Laboratory on Blockchain Technology, witnessed by Prof. Nancy IP, Vice-President for Research and Development of HKUST (back left), and Mr. CHEN Lei, Chief Executive Officer of Xunlei and Onething Technologies (back right)
Prof. Tim CHENG, Dean of Engineering of HKUST (front left), and Ms. LAI Xin, ThunderChain’s Chief Engineer of Xunlei (front right), sign the collaborative agreement to establish HKUST-Xunlei Joint Laboratory on Blockchain Technology, witnessed by Prof. Nancy IP, Vice-President for Research and Development of HKUST (back left), and Mr. CHEN Lei, Chief Executive Officer of Xunlei and Onething Technologies (back right). 
New Industry-Institute Joint Lab to Develop Cutting-Edge Technology
HKUST Robotics Team Named Champion in Hong Kong Regional of MATE International ROV Competition for Ninth Consecutive Year
Student Team Reigns Supreme in Local Qualifier for Global ROV Competition
IAS Bank of East Asia Professor TANG Ching-Wan Awarded 2019 Kyoto Prize in Advanced Technology
IAS Bank of East Asia Professor TANG Ching-Wan Awarded 2019 Kyoto Prize in Advanced Technology 
Prestigious Honor for Lifelong Pioneering Work on New Display Technology
Prof. Ricky LEE said the award is very meaningful to him because it recognizes his cumulative technical contributions to the electronics packaging community in the past two decades.
Prof. Ricky LEE said the award is very meaningful to him because it recognizes his cumulative technical contributions to the electronics packaging community in the past two decades.