Electronic and Computer Engineering

Prof. Yang Yansong (left), Assistant Professor of the Department of Electronic and Computer Engineering of HKUST, and his PhD student Qian Fangsheng (right) have developed a novel chip architecture that enables the miniature acoustic devices inside smartphones to withstand over 12 times higher power loads while maintaining cooler and more stable operation.
Prof. Yang Yansong (left), Assistant Professor of the Department of Electronic and Computer Engineering of HKUST, and his PhD student Qian Fangsheng (right) have developed a novel chip architecture that enables the miniature acoustic devices inside smartphones to withstand over 12 times higher power loads while maintaining cooler and more stable operation. 
Prof. Lin Yen-Hung, Assistant Professor of the Department of Electronic and Computer Engineering at HKUST (center), Dr. Fion Yeung Sze-Yan, Senior Manager at the State Key Laboratory of Displays and Opto-Electronics (left), Dr. Li Fengzhu, Research Assistant Professor of the Department of Electronic and Computer Engineering at HKUST (right), and other research team members published “Interface-mediated crystallization enables PEDOT:PSS-free all-perovskite tandems with 29.1% efficiency and enhanced durabilit
Prof. Lin Yen-Hung, Assistant Professor of the Department of Electronic and Computer Engineering at HKUST (center), Dr. Fion Yeung Sze-Yan, Senior Manager at the State Key Laboratory of Displays and Opto-Electronics (left), Dr. Li Fengzhu, Research Assistant Professor of the Department of Electronic and Computer Engineering at HKUST (right), and other research team members published “Interface-mediated crystallization enables PEDOT:PSS-free all-perovskite tandems with 29.1% efficiency and enhanced durability” in Joule. 
Advancing the Commercialization of Perovskite Photovoltaic Technology
PhD student Liu Yichen (second right) received the Second Place in the Student Paper Competition of the Radio Frequency Technology & Techniques Symposium in Boston, US in June 2026.
PhD student Liu Yichen (second right) received the Second Place in the Student Paper Competition of the Radio Frequency Technology & Techniques Symposium in Boston, US in June 2026. 
The IEEE 2026 Finals of the International Youth IC Challenge (China) and the Inaugural International IC Innovation and Education Forum were held at HKUST on May 17, 2026. The gathering attracted distinguished educators, leading chip experts, and school leaders from across China and overseas, fostering vibrant exchanges across academia, industry, and education sectors.
The IEEE 2026 Finals of the International Youth IC Challenge (China) and the Inaugural International IC Innovation and Education Forum were held at HKUST on May 17, 2026. The gathering attracted distinguished educators, leading chip experts, and school leaders from across China and overseas, fostering vibrant exchanges across academia, industry, and education sectors. 
Prof. Kei May Lau, Research Professor of the Division of Emerging Interdisciplinary Areas and Professor Emeritus of the Department of Electronic and Computer Engineering at HKUST (second right), has received the prestigious 2026 Heinrich Welker Award in the semiconductor field. Prof. Lau attended the award presentation ceremony held in Kumamoto, Japan, on May 25.
Prof. Kei May Lau, Research Professor of the Division of Emerging Interdisciplinary Areas and Professor Emeritus of the Department of Electronic and Computer Engineering at HKUST (second right), has received the prestigious 2026 Heinrich Welker Award in the semiconductor field. Prof. Lau attended the award presentation ceremony held in Kumamoto, Japan, on May 25. 
First Awardee Based on Achievements Accomplished in Hong Kong/China
The Champion team
The Champion team 
Applying Electronics Technologies to Improve Quality of Life
Electronic and Computer Engineering PhD student Ge Yuchu (center) at IEEE ISPSD 2026
Electronic and Computer Engineering PhD student Ge Yuchu (center) at IEEE ISPSD 2026 
The Materials Scientist Award honors Prof. Mansun Chan’s outstanding contributions to the advancement of materials science, engineering and technology.
The Materials Scientist Award honors Prof. Mansun Chan’s outstanding contributions to the advancement of materials science, engineering and technology. 
Recognizing Materials Innovation for CMOS
The cross-disciplinary research team includes co-corresponding authors Prof. Qu Jianan (right, back row) and Prof. Julie L. Semmelhack (right, front row), together with co-first authors Mr. Yan Gewei (left, back row) and Dr. Tian Guangnan (right, front row).
The cross-disciplinary research team includes co-corresponding authors Prof. Qu Jianan (right, back row) and Prof. Julie L. Semmelhack (right, front row), together with co-first authors Mr. Yan Gewei (left, back row) and Dr. Tian Guangnan (right, front row).