Engineering Career Fair Drew Over 400 Students

On March 31, 2026, over 400 undergraduate and postgraduate students attended the Engineering Career Fair, an initiative designed to connect emerging talent with industry professionals and explore diverse career opportunities.

Hosted by the Center for Industry Engagement and Internship (IEI) at the School of Engineering, the event showcased an impressive array of employers from various sectors: AEL, Baidu, Deloitte, EMSD, Gammon, Goertek, HAECO, Hong Kong Disneyland, HSBC Technology Centre China, Huawei, iFLYTEK, Kingboard, Mott MacDonald, and Tencent.

The event featured a dynamic program that included career booths, information sessions, CV photo booth, stamp collection activity, and lucky draw. Students had the opportunity to engage directly with company representatives, gaining valuable insights into the latest industry trends and defining their potential career paths.

This successful event provided a crucial platform for students to network, seek advice, and consider future employment opportunities in the engineering field.