Yunda WANG 王蘊達

Prof. Yunda WANG received his B.Eng degree from the School of Information Engineering of Xi'an Jiaotong University in 2005, M.Eng degree from the School of Electronics Engineering and Computer Science of Peking University in 2008, and Ph.D. degree from the Department of Mechanical Engineering of the University of Colorado Boulder in 2012. Since 2013, he has worked as a Postdoctoral Researcher, Member of Research Staff, and Senior Member of Research at Palo Alto Research Center and worked as the Principal investigator for multiple R&D projects. He joined the Smart Manufacturing Thrust, Systems Hub, The Hong Kong University of Science and Technology (Guangzhou) as an Associate Professor in 2021. Prof. Wang has published 30 research articles in journals/conferences including Science, APL, Journal of MEMS, Transducers, and MEMS conference. He authored 10 US patents/applications. He is the MEMS session co-chair of the 2013 International Electronic Packaging Technical Conference and Exhibition (InterPACK2013) and the technical committee member of the microsystem and device track of the 2019 iMAPS Device Packaging Conference. 

Prof. Wang’s research has focused on exploring disruptive innovation and developing key technologies in micro-electro-mechanical systems (MEMS), microsystem integration, and thermal management devices for sensor and electronics, that push the boundaries of science and engineering. Of special interest are areas including (a) micro-scale integration for hybrid electronics, emerging display technologies, large area sensors, wearable health monitoring devices, and human-machine interfaces and (b) emerging cooling technologies for electronics system thermal management.