Course Schedule
Students are required to complete a total of 25 credits of courses, including 4 credits of Guided Chip Design Project. Subject to prior approval of the Program Director, students may take a maximum of 9 credits of courses offered by other MSc programs. Students may take EESM 5900 for a maximum of 6 credits.
Tentative course offering schedule
2024-25 Fall Term
- (Core) EESM 5000 CMOS VLSI Design
- (Core) EESM 5060 Embedded Systems
- (Core) EESM 5100 Analog IC Analysis and Design
- (Core) EESM 5200 Semiconductor Devices for Integrated Circuit Designs
2024-25 Winter Term
- (Core) EESM 6970 Guided Chip Design Project
The class is designed to provide students with an experience of the complete IC design process in the industry from product definition to production and measurement. Taking a product in the market as an example, students are going to re-design the chip all the way from system definition, protocol design, selecting technology, installing technology file, digital building block design, analog building block design, digital analogy integration, ESD protection, post-design simulation, and tape out process. After that, the students will perform on-wafer testing, failure analysis, package selection, PCB design, test vector generation, reliability screening, ESD testing and data-sheet writing. Students completing this class are expected to have the equivalent experience of completing a full IC design cycle in the industry.
2024-25 Spring Term
- (Core) EESM 5020 Digital VLSI System Design and Design Automation
- (Core) EESM 5120 Advanced Analog IC Analysis and Design
- (Core) EESM 6970 Guided Chip Design Project (cont.)
- (Elective) EESM 5310 Power Management Circuits and Systems
- (Elective) EESM 5320 CMOS RF Integrated System and Circuits Design
All courses are offered subject to needs and availability. For the latest list of courses to be offered, visit Class Schedule & Quota.
For course details, please refer to Course Catalog.