Hongyu YU 于宏宇
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Hongyu Yu received the BS and MS degrees in Electronics Engineering from Tsinghua University, China, in 1997 and 2000, respectively, and the PhD degree in Electrical Engineering from the University of Southern California, USA, in 2005. He was a postdoctoral research associate at the University of Southern California from 2005-2007. He joined Arizona State University (ASU), USA, in 2008 holding as assistant professor (2008-2014) and associate professor (2014-2017) in both the School of Earth and Space Exploration and School of Electrical, Computer and Energy Engineering. During his tenure at ASU, he was the principal investigator for several projects from NASA, NSF, and Intel. He has joined HKUST since new year day of 2018. His research is providing engineering solutions for scientific studies and real-life demands and focuses on soft and compliant metamaterials and metastructure, and sensors and sensing platforms with applications for wearable electronics, space instrumentation, robotics, and consumer electronics.
Research Interests
Biography
Hongyu Yu received the BS and MS degrees in Electronics Engineering from Tsinghua University, China, in 1997 and 2000, respectively, and the PhD degree in Electrical Engineering from the University of Southern California, USA, in 2005. He was a postdoctoral research associate at the University of Southern California from 2005-2007. He joined Arizona State University (ASU), USA, in 2008 holding as assistant professor (2008-2014) and associate professor (2014-2017) in both the School of Earth and Space Exploration and School of Electrical, Computer and Energy Engineering. During his tenure at ASU, he was the principal investigator for several projects from NASA, NSF, and Intel. He has joined HKUST since new year day of 2018. His research is providing engineering solutions for scientific studies and real-life demands and focuses on soft and compliant metamaterials and metastructure, and sensors and sensing platforms with applications for wearable electronics, space instrumentation, robotics, and consumer electronics.