Ricky Shi-wei LEE 李世瑋
Ricky Shi-wei LEE 李世瑋 

Telephone Number

Email

Email
rickylee@ust.hk

Office

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Scopus ID

First Name (and Middle Name If Any)
Ricky Shi-wei
LEE
李世瑋
Highest Degree Acquired (e.g. PhD in Engineering Science)
PhD in Aeronautical and Astronautical Engineering, Purdue University

Contact Information

Telephone Number

Email

Email
rickylee@ust.hk

Office

Google Scholar

Scopus ID

Research Interests

Research Interests
Computational modeling
Electronic packaging
Lead-free soldering
Microelectromechanical systems (MEMS)
Optical fibers and light-emitting diode (LED) packaging

Biography

Biography

Prof Ricky Lee received his BSc and MSc degrees from National Taiwan University and Virginia Polytechnic Institute & State University, respectively. In 1992, he graduated from Purdue University with a PhD degree in Aeronautical & Astronautical Engineering. After one year of post-doctoral research at Purdue, he joined the Hong Kong University of Science & Technology (HKUST). During his career of tenure-track faculty at HKUST, Prof Lee once was on secondment to serve as Chief Technology Officer of Nano & Advanced Materials Institute (NAMI) for two and a half years. Currently Prof Lee is Chair Professor of Mechanical and Aerospace Engineering, and Director of Foshan Research Institute for Smart Manufacturing at HKUST. He also has concurrent appointments as Acting Dean of Systems Hub of HKUST Guangzhou campus, Executive Director of Shenzhen Platform Development Office, and Director of HKUST LED-FPD Technology R&D Center at Foshan, Guangdong, China. Prof Lee has been focusing his research on the development of packaging and assembly technologies for electronics and optoelectronics. The topics of his R&D interests include wafer level packaging and 3D IC integration, additive manufacturing, LED packaging for solid-state lighting, lead-free soldering and reliability analysis. The research outcomes of Prof Lee’s group have been documented in numerous technical papers in international journals and conference proceedings. He also co-authored 4 books and 9 book chapters. Due to his technical contributions, Prof Lee received many honors and awards over the years. In addition to being the recipient of 13 best/outstanding paper awards and 6 major professional society awards, Prof Lee is Fellow of IEEE, ASME, IMAPS, and Institute of Physics (UK). He is also Editor-in-Chief of ASME Journal of Electronic Packaging.

Research Interests

Research Interests
Computational modeling
Electronic packaging
Lead-free soldering
Microelectromechanical systems (MEMS)
Optical fibers and light-emitting diode (LED) packaging

Biography

Biography

Prof Ricky Lee received his BSc and MSc degrees from National Taiwan University and Virginia Polytechnic Institute & State University, respectively. In 1992, he graduated from Purdue University with a PhD degree in Aeronautical & Astronautical Engineering. After one year of post-doctoral research at Purdue, he joined the Hong Kong University of Science & Technology (HKUST). During his career of tenure-track faculty at HKUST, Prof Lee once was on secondment to serve as Chief Technology Officer of Nano & Advanced Materials Institute (NAMI) for two and a half years. Currently Prof Lee is Chair Professor of Mechanical and Aerospace Engineering, and Director of Foshan Research Institute for Smart Manufacturing at HKUST. He also has concurrent appointments as Acting Dean of Systems Hub of HKUST Guangzhou campus, Executive Director of Shenzhen Platform Development Office, and Director of HKUST LED-FPD Technology R&D Center at Foshan, Guangdong, China. Prof Lee has been focusing his research on the development of packaging and assembly technologies for electronics and optoelectronics. The topics of his R&D interests include wafer level packaging and 3D IC integration, additive manufacturing, LED packaging for solid-state lighting, lead-free soldering and reliability analysis. The research outcomes of Prof Lee’s group have been documented in numerous technical papers in international journals and conference proceedings. He also co-authored 4 books and 9 book chapters. Due to his technical contributions, Prof Lee received many honors and awards over the years. In addition to being the recipient of 13 best/outstanding paper awards and 6 major professional society awards, Prof Lee is Fellow of IEEE, ASME, IMAPS, and Institute of Physics (UK). He is also Editor-in-Chief of ASME Journal of Electronic Packaging.