Cover Story 12 IN FOCUS e it clothes, jewelry, buildings, or hospital beds, the realization of ubiquitous AI applications in society is now moving closer through the groundbreaking work of Asia’s first transnational research and development center on AI chip design, led by Dean of Engineering Prof. Tim CHENG Kwang-Ting. B The multidisciplinary AI Chip Center for Emerging Smart Systems (ACCESS) is striving to revolutionize the global AI chip design and talent pipelines. To achieve this, it is bringing together a leading end-to-end R&D consortium of expertise that is driving forward innovation through novel AI chips that improve performance and energy efficiency AI chips… with everything A new world of mass customization in which everyday devices are enhanced by greater intelligence is set to be fast forwarded through a unique multinational research center, helmed by the head of the School of Engineering Prof. Tim Cheng together with PhD student Wang Xiaomeng at work at the AI chip design center.
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