US Human Factors and Ergonomics Society (HFES) Prof Ravindra Goonetilleke Industrial Engineering and Logistics Management Prof Goonetilleke is the first member from Hong Kong and the Greater China region to be elected as a Fellow. This honor acknowledges his outstanding professional contributions to the Society and to human factors and ergonomics, as well as his achievements to advance the discipline and science of this field. His work on design related issues has been internationally recognized and his various projects have won top awards both in Hong Kong and around the world. He is a Hong Kong representative of the International Ergonomics Association, of which HFES is a member. Institution of Structural Engineers (IStructE) and Institution of Civil Engineers (ICE) Prof Christopher Leung Civil and Environmental Engineering Prof Leung has been elected Fellow for his research in composite materials and their applications. He is a pioneer in the development of pseudo-ductile cementitious composites (PDCC) that exhibit high deformation and energy-absorption capabilities. These materials are now being employed in the US, Japan and China for various applications including structural members in buildings to enhance seismic resistance, deck surface and joints of bridges to improve durability, and the surface repair of deteriorated concrete dams. His major contribution is the establishment of a fundamental theory that provides material selection guidelines to achieve the desirable properties of PDCC. International Congress on Fracture – The World Academy of Structural Integrity (ICF-WASI) Prof Tongyi Zhang Chair Professor of Mechanical and Aerospace Engineering Prof Zhang has been elected for his research in the interdisciplinary area between materials science and solid mechanics. He has made significant contributions to the fracture of piezoelectric materials under electrical and/or mechanical loading. He has established a novel testing technique, called microbridge tests, to characterize the mechanical properties of materials in small scales, which is very difficult to achieve in a conventional way. Recently, he discovered the mechanism behind the size-dependent mechanical properties of nanomaterials such as nanowires and thin films. Prof Zhang is also Vice-President of the ICF Society. International Microelectronics Assembly and Packaging Society (IMAPS) Prof Ricky Lee Mechanical and Aerospace Engineering Prof Lee has been elected Fellow for his research and development efforts related to the packaging and assembly of integrated circuits (IC), optoelectronic devices and microsystems. His research covers chip scale and wafer-level packaging, through-silicon vias (TSV) and 3D IC integration, LED packaging, and solder joint reliability. He has made vital contributions to a number of areas, namely applications of finite element method and fracture mechanics to the stress analysis of electronic components and systems; investigation of board-level solder joint reliability under thermal and mechanical loading; research on TSV technologies for 3D IC integration; and development of LED wafer-level packaging technologies. International Society for Optics and Photonics (SPIE) Prof Jianan Qu Electronic and Computer Engineering Prof Qu has been elected Fellow in recognition of his achievements in biomedical optics, especially in areas of optical diagnosis of early cancer and multiphoton spectroscopy. His significant discoveries have pioneered a variety of highly innovative technologies that pave the road for the translation of advanced optical technologies to molecular bio-imaging and clinical applications. He has been a member of SPIE since 1994 and currently serves as an editorial board member of the Journal of Biomedical Optics. IN FOCUS 12
RkJQdWJsaXNoZXIy NDk5Njg=